Teilkatalog Robotik 10-2019 (nur in englischer Sprache), Überblick



Beschreibung

Hier finden Sie technische Daten, Masszeichnungen sowie Bestellangaben zu den Produkten der iselRobotik!

Laden Sie den neu überarbeiteten Teilkatalog Robotik 10-2019 als PDF-Datei herunter!
(nur in englischer Sprache verfügbar - ca. 5 MB)

The product offerings contained in this catalog are a subset of robotic products offered by the isel group. Our products are specifically designed and engineered to address the unique needs and requirements of the semiconductor, flat panel display, nano-technology, and related industries.

Should you have a special application or product requirement not fully addressed by the offerings in this catalog, please contact us we will be delighted to work with you to find a solution that meets your needs.


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Wafer Handling components

for the semiconductor industry

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2

efficient & economical

Wafer Handlers

Your added value
in tHe semi-conductor industrY

customer-specific solutions

high production depth made in Germany

ISO 1 Clean room certification for wafer handlers

free training for new customers

throughput analysis

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3

3

This catalogue contains a variety of robotic products

offered by the isel group. Our products are specifically

designed and engineered to address the unique needs

and requirements of the semiconductor, flat panel

display, nano-technology, and related industries.

If you have special applications or product require-

ments please contact us. With several thousand

systems in field and many years of experience, we

look forward to receiving your inquiries.

content

General  ......................................................................4
Wafer  handling  robots  .............................................8
Controller and software ...........................................20
Endeffectors ..............................................................24
Accessories  ..............................................................26
Linear Track ..............................................................28
Prealigners  ...............................................................30
Quality assurance and references .............................32
About us ..................................................................33
Notes  .......................................................................34

thomas völlinger

Division manager

+49 (0) 6659 981-756
Thomas.Voellinger@isel.com

andreas möller

Technical sales

+49 (0) 6659 981-755
Andreas.Moeller@isel.com

michael raschke

Service

+49 (0) 6659 981-754
Robotik.Service@isel.com

vanessa Krack

Team assistant

+49 (0) 6659 981-748
Vanessa.Krack@isel.com

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4

innovative

tecHnologY

The ADVANCED controller has a defined

path speed, so that speed and accelera-

tion focus on the tool centre point (TCP)

and not on the individual axes.

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5

5

first class service

Free training for new customers, telephone

support and ongoing project support from

experienced isel technicians.

Our main focus is always to please our

customers with excellent service.

Trust our worldwide service, e.g. with long-

term partners in Asia or our partner in

the USA. The high spare part availability

reduces your downtime to a minimum.

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6

6

customer-specific

solutions

You will get the perfect handling system for

your production. On request, we can tailor your

handling robots individually from isel compo-

nents to provide high-performance automation

solutions that are optimally aligned to your

production requirements and with significantly

short production times. If the standard cannot

meet the requirements, we offer you individual

solutions.

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7

innovative robot

tecHnologY for

Wafer Handling

Robust and long-lasting-all-in-on solutions,

customer-specific manufacturing, compre-

hensive project support: isel Germany AG

is the perfect partner for wafer handling

components in the semiconductor industry.

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8

Wafer Handling robot |

IWH

WITh 2-LINK COMPACT ARM AND 7" bODY SERIES 1

cHaracteristics

wafer handling up to 200 mm

cost-effective

excellent structural rigidity and precision

maximum reliability

top mounted (TA) or bottom mounted (bA)

versions available

customized solutions

incremental encoder

seamless integration with prealigner, linear

track and other peripheral components

including „STANDARD“ controller and software

ISO 1 clean-room environment compatible

MTbF: >70,000 operating hours

specifications

Repeatability

T

±0.02°

R

±0.02 mm

Z

±0.02 mm

Working

range

Z

7"

radial

10", 14"

theta

450°

Payload

up to 1 kg*

Maximum

speed

T

360°/s

R

1,000 mm/s

Z

450 mm/s

Power supply

115 – 230 VAC

50 – 60 hz

300 VA

Main interface

RS-232 [Db9],

Ethernet [RJ-45]

Weight

approx. 19 kg

* depending on arm configuration

iWH ta07s10 f-1
(endeffector see page 24)

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9

323,7 (S10)

430,8  (S14)

323,7 (S10)

430,8 (S14)

25

57

49

35,3

4x M3

S10

25

57

65

35,3

4x M3

50,8

4x M4

S14

323,7 (S10)

430,8  (S14)

323,7 (S10)

430,8 (S14)

25

57

49

35,3

4x M3

S10

25

57

65

35,3

4x M3

50,8

4x M4

S14

323,7 (S10)

430,8  (S14)

323,7 (S10)

430,8 (S14)

25

57

49

35,3

4x M3

S10

25

57

65

35,3

4x M3

50,8

4x M4

S14

323,7 (S10)

430,8  (S14)

323,7 (S10)

430,8 (S14)

25

57

49

35,3

4x M3

S10

25

57

65

35,3

4x M3

50,8

4x M4

S14

iWH ta 07s_f-1

iWH ba 07s_f-1

dimensions

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10

iWH ta10s10Hd f-1

Fraunhofer

IPA

T E S T E D

D E V I C E

isel Germany AG

IWH-BA13S14HDF-1

Report No. IS 1103-547

Wafer Handling robot |

IWH

WITh 2-LINK hEAVY DUTY ARM AND bODY SERIES 1

cHaracteristics

excellent structural rigidity and precision

maximum reliability

top mounted (TA) or bottom mounted (bA)

versions available

customized solutions

absolute or incremental encoder

seamless integration with prealigner,

linear track and other peripheral components

including „STANDARD“ or „ADVANCED“

controller and software

ISO 1 clean-room

environment compatible

MTbF: >70,000 operating hours

specifications

Repeatability

T

±0.02°

R

±0.02 mm

Z

±0.02 mm

Working

range

Z

10", 13", 17", 21"

radial

10", 12", 14", 16", 20"

theta

500°

Payload

up to 3 kg*

Maximum

speed

T

360°/s

R

1,000 mm/s

Z

450 mm/s

Power supply

115 – 230 VAC

50 – 60 hz

500 VA (STANDARD)

550 VA (ADVANCED)

Main interface

RS-232 [Db9],

Ethernet [RJ-45]

Weight

approx. 25 – 32 kg

* depending on arm configuration

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330  (TA13)

588,5

(TA13)

690

(TA17)

105

329,9

(TA13)

431,8

(TA17)

254

(TA10)

235

277  (TA10 / TA17 / TA21)

791,5  (TA21)

533,4  (TA21)

513,5

(TA10)

266,7  (S10)

365,8  (S14)

426,7  (S16)

508  (S20)

75

304,8  (S12)

259,1 (313,7)

3 x M6

341,7  (S10)

379,8  (S12)

440,8  (S14)

500,8  (S16)

583  (S20)

633,5

(BA10)

90

235

708,5

(BA13)

810

(BA17)

254

(BA10)

330,2

(BA13)

431,5

(BA17)

911,5  (BA21)

533,4  (BA21)

185

225

175

195

266,7  (S10)

304,8  (S12)

365,8  (S14)

426,7  (S16)

508  (S20)

75

341,7  (S10)

379,8  (S12)

440,8  (S14)

501,7  (S16)

583  (S20)

4 x M6

67

25

50,8  (4x M4)

35,3  (4x M3)

IWH TA __ S __ HD F-1

IWH BA__ S __ HD F-1

330  (TA13)

588,5

(TA13)

690

(TA17)

105

329,9

(TA13)

431,8

(TA17)

254

(TA10)

235

277  (TA10 / TA17 / TA21)

791,5  (TA21)

533,4  (TA21)

513,5

(TA10)

266,7  (S10)

365,8  (S14)

426,7  (S16)

508  (S20)

75

304,8  (S12)

259,1 (313,7)

3 x M6

341,7  (S10)

379,8  (S12)

440,8  (S14)

500,8  (S16)

583  (S20)

633,5

(BA10)

90

235

708,5

(BA13)

810

(BA17)

254

(BA10)

330,2

(BA13)

431,5

(BA17)

911,5  (BA21)

533,4  (BA21)

185

225

175

195

266,7  (S10)

304,8  (S12)

365,8  (S14)

426,7  (S16)

508  (S20)

75

341,7  (S10)

379,8  (S12)

440,8  (S14)

501,7  (S16)

583  (S20)

4 x M6

67

25

50,8  (4x M4)

35,3  (4x M3)

IWH TA __ S __ HD F-1

IWH BA__ S __ HD F-1

330  (TA13)

588,5

(TA13)

690

(TA17)

105

329,9

(TA13)

431,8

(TA17)

254

(TA10)

235

277  (TA10 / TA17 / TA21)

791,5  (TA21)

533,4  (TA21)

513,5

(TA10)

266,7  (S10)

365,8  (S14)

426,7  (S16)

508  (S20)

75

304,8  (S12)

259,1 (313,7)

3 x M6

341,7  (S10)

379,8  (S12)

440,8  (S14)

500,8  (S16)

583  (S20)

633,5

(BA10)

90

235

708,5

(BA13)

810

(BA17)

254

(BA10)

330,2

(BA13)

431,5

(BA17)

911,5  (BA21)

533,4  (BA21)

185

225

175

195

266,7  (S10)

304,8  (S12)

365,8  (S14)

426,7  (S16)

508  (S20)

75

341,7  (S10)

379,8  (S12)

440,8  (S14)

501,7  (S16)

583  (S20)

4 x M6

67

25

50,8  (4x M4)

35,3  (4x M3)

IWH TA __ S __ HD F-1

IWH BA__ S __ HD F-1

330  (TA13)

588,5

(TA13)

690

(TA17)

105

329,9

(TA13)

431,8

(TA17)

254

(TA10)

235

277  (TA10 / TA17 / TA21)

791,5  (TA21)

533,4  (TA21)

513,5

(TA10)

266,7  (S10)

365,8  (S14)

426,7  (S16)

508  (S20)

75

304,8  (S12)

259,1 (313,7)

3 x M6

341,7  (S10)

379,8  (S12)

440,8  (S14)

500,8  (S16)

583  (S20)

633,5

(BA10)

90

235

708,5

(BA13)

810

(BA17)

254

(BA10)

330,2

(BA13)

431,5

(BA17)

911,5  (BA21)

533,4  (BA21)

185

225

175

195

266,7  (S10)

304,8  (S12)

365,8  (S14)

426,7  (S16)

508  (S20)

75

341,7  (S10)

379,8  (S12)

440,8  (S14)

501,7  (S16)

583  (S20)

4 x M6

67

25

50,8  (4x M4)

35,3  (4x M3)

IWH TA __ S __ HD F-1

IWH BA__ S __ HD F-1

iWH ta __ s __ Hd f-1

iWH ba__ s __ Hd f-1

dimensions

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iWH ta10s16 f-1

Wafer Handling robot |

IWH

WITh 3-LINK hEAVY DUTY ARM AND bODY SERIES 1

cHaracteristics

excellent structural rigidity and precision

maximum reliability

top mounted (TA) or bottom mounted (bA) versions available

customized solutions

absolute or incremental encoder

seamless integration with prealigner, linear track

and other peripheral components

including „STANDARD“ or „ADVANCED“ controller and software

ISO 1 clean-room environment compatible

MTbF: >70,000 operating hours

specifications

Repeatability

T

±0.02°

R

±0.02 mm

Z

±0.02 mm

Working

range

Z

10", 13", 17"

radial

16", 21", 24", 28"

theta

500°

Payload

up to 3 kg*

Maximum

speed

T

360°/s

R

1,000 mm/s

Z

450 mm/s

Power supply

115 – 230 VAC

50 – 60 hz

500 VA (STANDARD)

550 VA (ADVANCED)

Main interface

RS-232 [Db9],

Ethernet [RJ-45]

Weight

approx. 25 – 32 kg

* depending on arm configuration

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13

330  (TA13)

690

(TA17)

235

277  ( TA10 / TA17 / TA21)

142

254

(TA10)

329,9

(TA13)

431,8

(TA17)

791,5  (TA21)

533,4  (TA21)

513,5

(TA10)

588,5

(TA13)

533,4  (S24)

304,8  (S16)

75

731,5  (S28)

406,4  (S21)

278,2  (S16)

342  (S21)

380  (S24)

441  (S28)

259,1 (Ø313,7)

3xM6

670,5

(BA10)

745,5

(BA13)

847

(BA17)

127

330,2

(BA13)

431,8

(BA17)

533,4  (BA21)

948,5  (BA21)

254  (BA10)

235

185

225

175

195

406,4   (S21)

533,4   (S24)

304,8  (S16)

731,5   (S28)

75

278,2  (S16)

342  (S21)

380  (S24)

441  (S28)

4xM6

67

25

50,8  (4x M4)

35,3  (4x M3)

IWH TA __ S __  F-1

IWH BA __ S __  F-1

330  (TA13)

690

(TA17)

235

277  ( TA10 / TA17 / TA21)

142

254

(TA10)

329,9

(TA13)

431,8

(TA17)

791,5  (TA21)

533,4  (TA21)

513,5

(TA10)

588,5

(TA13)

533,4  (S24)

304,8  (S16)

75

731,5  (S28)

406,4  (S21)

278,2  (S16)

342  (S21)

380  (S24)

441  (S28)

259,1 (Ø313,7)

3xM6

670,5

(BA10)

745,5

(BA13)

847

(BA17)

127

330,2

(BA13)

431,8

(BA17)

533,4  (BA21)

948,5  (BA21)

254  (BA10)

235

185

225

175

195

406,4   (S21)

533,4   (S24)

304,8  (S16)

731,5   (S28)

75

278,2  (S16)

342  (S21)

380  (S24)

441  (S28)

4xM6

67

25

50,8  (4x M4)

35,3  (4x M3)

IWH TA __ S __  F-1

IWH BA __ S __  F-1

330  (TA13)

690

(TA17)

235

277  ( TA10 / TA17 / TA21)

142

254

(TA10)

329,9

(TA13)

431,8

(TA17)

791,5  (TA21)

533,4  (TA21)

513,5

(TA10)

588,5

(TA13)

533,4  (S24)

304,8  (S16)

75

731,5  (S28)

406,4  (S21)

278,2  (S16)

342  (S21)

380  (S24)

441  (S28)

259,1 (Ø313,7)

3xM6

670,5

(BA10)

745,5

(BA13)

847

(BA17)

127

330,2

(BA13)

431,8

(BA17)

533,4  (BA21)

948,5  (BA21)

254  (BA10)

235

185

225

175

195

406,4   (S21)

533,4   (S24)

304,8  (S16)

731,5   (S28)

75

278,2  (S16)

342  (S21)

380  (S24)

441  (S28)

4xM6

67

25

50,8  (4x M4)

35,3  (4x M3)

IWH TA __ S __  F-1

IWH BA __ S __  F-1

330  (TA13)

690

(TA17)

235

277  ( TA10 / TA17 / TA21)

142

254

(TA10)

329,9

(TA13)

431,8

(TA17)

791,5  (TA21)

533,4  (TA21)

513,5

(TA10)

588,5

(TA13)

533,4  (S24)

304,8  (S16)

75

731,5  (S28)

406,4  (S21)

278,2  (S16)

342  (S21)

380  (S24)

441  (S28)

259,1 (Ø313,7)

3xM6

670,5

(BA10)

745,5

(BA13)

847

(BA17)

127

330,2

(BA13)

431,8

(BA17)

533,4  (BA21)

948,5  (BA21)

254  (BA10)

235

185

225

175

195

406,4   (S21)

533,4   (S24)

304,8  (S16)

731,5   (S28)

75

278,2  (S16)

342  (S21)

380  (S24)

441  (S28)

4xM6

67

25

50,8  (4x M4)

35,3  (4x M3)

IWH TA __ S __  F-1

IWH BA __ S __  F-1

iWH ta __ s __  f-1

iWH ba __ s __  f-1

dimensions

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iWH ta13s24Hdp f-3

Wafer Handling robot |

IWH

WITh 2-LINK hDPLUS ARM AND bODY SERIES 3

cHaracteristics

excellent structural rigidity and precision

maximum reliability

top mounted (TA) or bottom mounted (bA) versions available

customized solutions

absolute or incremental encoder

seamless integration with prealigner, linear track

and other peripheral components

including „STANDARD“ or „ADVANCED“

controller and software

MTbF: >70,000 operating hours

specifications

Repeatability

T

±0.02° / ±0.03°

R

±0.02 mm

Z

±0.02 mm

Working

range

Z

7", 10", 13", 15", 17", 21"

radial

16", 24"

theta

450°

Payload

up to 5 kg*

Maximum

speed

T

180°/s / 360°/s

R

800 mm/s

Z

425 mm/s

Power supply

115 – 230 VAC

50 – 60 hz

500 VA (STANDARD)

550 VA (ADVANCED)

Main interface

RS-232 [Db9],

Ethernet [RJ-45]

Weight

approx. 25 – 40 kg

* depending on arm configuration

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15

7“ [372,5mm] 10“ [449mm] 13“ [525mm] 17“ [576mm] 21“[677,6mm]

dimensions

mounting screws

turning radius min. Ø 700 mm

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Wafer Handling robot |

IWH

WITh 2-LINK DUAL ARM AND bODY SERIES 3

cHaracteristics

excellent structural rigidity

wafer handling up to 300mm

maximum reliability and precision

seamless integration with prealigner, linear track

and other peripheral components

very smooth running

backlash free harmonic Drive® gears

absolute or incremental encoder

integrated 2-channel vacuum display

(STANDARD controller)

fully integrated software adjustable vacuum

sensors (ADVANCED controller)

including „STANDARD“ or „ADVANCED“

controller and software

ISO 1 clean-room environment compatible

MTbF: >70,000 operating hours

option: 2 flip modules iFM-300-3

specifications

Repeatability

T

±0.02°

R

±0.02 mm

Z

±0.02 mm

Working

range

Z

7", 10", 13", 15", 17", 21"

radial

10", 14"

theta

500°

Payload

up to 1.25 kg (per arm)*

Maximum

speed

T

360°/s

R

1,100 mm/s

Z

425 mm/s

Power supply

115 – 230 VAC

50 – 60 hz

500 VA (STANDARD)

550 VA (ADVANCED)

Main interface

RS-232 [Db9],

Ethernet [RJ-45]

Weight

approx. 25 – 40 kg

*depending on arm configuration

iWH f-3
dual arm robot

vaccum displays
with STANDARD controller

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17

330 (TA)

7"    [387,5mm] 10"  [464mm] 13"  [540mm] 17"  [591mm] 21"  [692,6mm]

11,18

284

10,98

279

7"   [177,8mm] 10" [254mm] 13" [381mm] 17" [431,8mm] 21" [533,4mm]

[0,39]

10

2x5,25" / 7,2"

110,5

210

4xM8

166,2   216,5

455 (10" Arm)

555 (14" Arm)

530 (10" Arm)

696 (14" Arm)

300 3xM6

dimensions

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18

Wafer Handling robot |

IWH

WITh ShD SUPER hEAVY DUTY DUAL ARM AND ShD bODY

cHaracteristics

excellent structural rigidity

wafer handling of up to 450 mm

maximum reliability and precision

seamless integration with prealigner, linear track

and other peripheral components

very smooth running

backlash free harmonic Drive® gears

absolute or incremental encoder

fully integrated software adjustable vacuum sensors

(ADVANCED controller)

including „ADVANCED“ controller and software

ISO 1 clean-room environment compatible

MTbF: >70,000 operating hours

option: 2 flip modules iFM-300-3

specifications

Repeatability

T

±0.02°

R

±0.02 mm

Z

±0.02 mm

Working

range

Z

13", 15"

radial

14"

theta

500°

Payload

up to 3 kg (per arm)*

Maximum

speed

T

180°/s

R

800 mm/s

Z

300 mm/s

Power supply

115 – 230 VAC

50 – 60 hz

800 VA

Main interface

RS-232 [Db9],

Ethernet [RJ-45]

Weight

approx. 60 kg

*depending on arm configuration

iWH f-3 sHd dual arm robot
(example of application, endeffectors see page 24)

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19

420 (TA)

350

13" [542mm] 15" [614mm]

10

13" [330mm] 15" [400mm]

156,5

7,2" [182,9mm]

120

260

4x M8

217,5

300

23,54" [598 mm]

24,80

27,8" [705,8mm]

390

3xM6

dimensions

mounting screws

turning radius min. Ø 630 mm

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controller & softWare |

„ADVANCED“

The ADVANCED controller is based on a continuous path control with integrated safety PLC which incorporates state-of-

the-art technology. The innovative path control guaranties a constant and maximum speed on the TCP which ensures

additional safety during handling substrates. The controller runs internally with the Powerlink real time bus system which

improves performance even further.

cHaracteristics

innovative user interface

powerful control electronics „State of the Art“

integrated safety control according

to DIN EN ISO 10218-1

resolver or EnDat-2.2 encoder

19" rack 4hE or desk version

interface: Ethernet, RS232

dimensions: 392 x 169 x 415 mm

weight: 10 kg

option: teach pendant

third party certified by TÜV for

- ISO 10218-1 (Robot safety)

- USA compliance

- Korea compliance

advanced
controller front

advanced
controller back

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AccessoRy

teacH pendant

for ADVANCED controller

optimal support when setting up an isel wafer handler

with ADVANCED controller

GUI on a 6,5" VGA colour display

ergonomic multi-grip for fatigue-free work

hand wheel for jogging operation

enable switch and stop button for safe

manual operation (complies with EN ISO 13850)

The supported high voltage technology offers very dynamic behavior when using an additional linear motor axis.

isel ADVANCED controllers complies with current international standards for industrial robots. The operating interface

integrated into the controller can be visualized on any PC with a VNC viewer. It provides an innovative and intuitive

GUI for setting up and managing the ADVANCED robot system. The ADVANCED robot controller is made by isel.

softWare

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controller & softWare |

„STANDARD“

The controller is completely integrated

into wafer handler body. It is in

widespread use for over 15 years and

proved in the semiconductor industry.

because there is no separate external

controller the handling system requires

only very little space. It is also well suited

for replacing other robot systems (emulations

are available on request).

cHaracteristics

less wiring

large range of functions

alignment on the fly function (OTF)

integrated electronic (all in one design)

15 years field experience

interface: RS232, Ethernet

option: hand terminal

isel standard robot controller

all-in-one-design

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rcc software

AccessoRy

Hand terminal

for STANDARD controller

optimal support while teaching

an isel wafer handler

keyboard layout optimized

for isel wafer handlers

terminal function

teach function

softWare

The Windows-based RCC software supplies support for setting up and management

of the robot system and its extensive functions. The "STANDARD" hardware and

software provides a huge range of pre-installed macro programmes.

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end effectors |

IEE SERIES

cHaracteristics

for wafer sizes up to 18" (450 mm)

high rigidity

good cost/performance ratio

PTFE SafeCoat (Standard) for each of our robots

TAP to EE 30 mm (Standard bracket)

options

different wafer mapping sensors

several surface coatings

special designs: pocket - friction wafer -

edge grip - exclusion zone vacuum

paddle
with mapping sensor

Horse shoe
without mapping
sensor

double
with through beam
mapping

exclusion
zone vacuum
with mapping sensor

customized

filmring

Our end effectors are designed for wafer handling between the different stations.

iselRObOTIK end effectors are available for wafer sizes from 2“ (50mm) up to 18“ (450mm).

Each of our end effector fits each of our robots.

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options

different wafer mapping sensors

several surface coatings

special designs: pocket - friction wafer -

edge grip - exclusion zone vacuum

AccessoRy

vacuum control

fast response

free programmable

resolution of 0.001 bar

integrated in endeffector

bicoloured display

useable for all vacuum

end effectors

extended
version

ceramic

edge grip

vacuum
exclusion zone

The end effectors are optionally available with many different contact materials such as PTFE (SafeCoat), PEEK,

VITON, KALREZ. In addition to this we also offer many special designs for your special wafers and substrates.

For your individual end effector requirements we will find the solution.

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ims-mdW1

separate through

beam unit

pd45

through beam

sensor

Wafer mapping sensors

ims-mdW1

LED light source

measuring distance 45 mm (1.75")

PNP / NPN switchable

pd45

laser (class 2) light source

measuring distance 200 mm or 300 mm

small laser dot and housing

tHrougH beam sensor

optional to reflective Sensor

integrated in endeffector

or as separate unit

more suitable for thin wafer mapping

flip module ifm-300-3

precise wafer flipping by adjustable

mechanical stops

universal endeffector adapter

adjustable hard stop damping

adjustable flip speed

option: lateral mapping sensor

TAP to EE 100 mm

accessories

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YaW axis

4th axis upgrade for a three-axis system

(yaw angle in the R axis)

in-line handling of rectangular substrates

in-line handling without a linear track

upgrade for existing isel hD arm wafer

handling robots

alignment on tHe flY

wafer centering without prealigner

offset centering during PUT movement

no alignment station necessary

time efficient wafer centering

end effector cHanger

(ADVANCED controller only)

full automatically endeffector

changing system

software endeffector management

for all endeffector types

= laser sensors

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cHaracteristics

speed up to 4,5m/s

acceleration up to 10 m/s²

total length up to 32 m

repeatability +/- 0.01 mm

option: top or side mounting

fully integrated into the robot system

direct drive motor

low-maintenance

MTbF: >70,000 operating hours

specifications

Repeatability

±0.01 mm

Motor

direct drive

Maximum speed

4.5 m/s

Maximum length

32 m

Maximum acceleration

10 m/s²

In order to increase the robot's radius of action, the handling system can simply be expanded by adding a further

axis that is fully integrated into the system. Depending on the application, it can be mounted below the wafer

handler or with the wafer handler mounted on the side. Due to the use of linear motors, the linear axes are very

dynamic, low-maintenance and smooth-running. They achieve high acceleration values and speeds, approach

positions very precisely and work practically wear-free due to the omission of mechanical connecting links.

Due to the segment design, lengths of up to 32 meters with absolute encoders can be realized.

top mounted

side mounted

LINEAR TRACK |

ILD SERIES

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111

50

14.5

8.1

12

7

37.5

150

A

211

Length

260

50

150

235

~ 26

50

190

148

Accessories: assemble set

111

50

14.5

8.1

12

7

37.5

150

A

211

Length

260

50

150

235

~ 26

50

190

148

Accessories: assemble set

dimensions

AccessoRy

assemble set

for aligning the axes

(consisting of two adapter plates,

four nuts, two leveling bolts and

mounting material)

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PREALIGNERS |

LPA SERIES

features
ThREE-AxIS PREALIGNERS

innovative all-in-one design

alignment times < 3.5 seconds

repeatability: linear 0.025 mm,

circular 0.02°

contactless measurement using LED

and ccD sensor

integrated scanning electronics

standalone capability

chuck or pin load and change to another

wafer size without rebuild

transparent, semi-transparent, holed and

opaque wafers can be aligned

SEMI, flat and notch wafer specifications

for wafer sizes from 2" to 18"

connection fields available from the side

and from below

option: external (notch sensor)

option: dual layer for bonded wafer

SINGLE AxIS PREALIGNER

alignment times < 2.5 seconds

contactless measurement using LED

and ccD sensor

integrated scanning electronics

chuck load

change to another wafer size without rebuild

transparent, semi-transparent, holed and

opaque wafers can be aligned

All, flat and notch wafer specifications

for wafer sizes from 3" to 12"

connection panel available at the side

and from below

The LPA series prealigners are an innovative, high-precision, class 1 clean room solution with integrated

scan electronics. These prealigners make it possible to align objects from 45 mm to 480 mm, regardless

of their degree of transparency. They centre wafers, masks and other substrates, detect notches, flats or

other marks and align the object exactly and independently.
The prealigners are developed and produced by Logosol Inc. USA.

isel Germany AG is the exclusive authorised distributor for Europe.

three-axis prealigner lpa series

with lateral connectors and

PEEK-pin/chuck

three-axis edge
handling prealigner
with lateral connectors

single-axis prealigner

lpa series

with bottom connectors

configuration

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cHaracteristics

26-3

38-3

58-3

312-3

812-3

1218-3

25-1E

38-1E

58-1E

312-1E

812-1E

1218-1E

N/A

N/A

10mm

9mm

W

L

404mm

328mm

H

More than 70000 hours

267mm

317mm

Specifications

Standalone

Embedded

450mm

Square Substrates

Wafer

Diameter

MTBF

Host Interface

Flat/Notch

Compatibility

Wafer Opacity

Cleanliness

RS 232, Ethernet

Semi Standards Compliant

Edge Handling

PREALIGNER MODEL

150mm

200mm

300mm

100mm

3“

2“

125mm

Type

4EH, 45EH

5EH, 45EH, 56EH

6EH, 56EH

8EH, 8ET

173mm

1.7mm to 2.0mm

10mm

0.06º

0.04º

50um

Edge Handling

190mm to 206mm

267mm or 317mm

95mm

266mm

191mm

12ET

N/A

Centering Accuracy

Facilities Required

12mm

0.04º

173mm

190mm

Weight

Servo Axes

Handling

0.02º

0.04º

0.02º

25um

25um

5.3kg to 6.0kg

Transparent, Semi-Transparent

Class 1

10000 CPR

Encoder

24000 CPR

Encoder

Angular

Accuracy

(3 Sigma)

(3 Sigma)

Body

Dimensions

Max Initial Offset

3.4kg to 3.8kg

One

5.0kg to 5.7kg

Three

Three

Vacuum Chuck and Pins

Vacuum Chuck

100-240VAC, 50/60Hz; 48VA or  24 DC/2A, Vacuum 12“ Hg for vacuum retention

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HSEB

I

NNO

L

AS

Innovative

Lasertechnologie

HSEB

I

NNO

L

AS

Innovative

Lasertechnologie

references

Subsequently you'll find a selection of companies that participated in a successful co-operation with us

and that successfully use our products:

QualitY assurance

The quality assurance system for our products

includes all areas which contribute to the

attainment of quality objectives. It is based

on statutory requirements, customer require-

ments and the internal quality requirements

of isel Germany AG.

The quality assurance system ensures that the

production processes are controllable and that

only products that meet the respective specifi-

cations are forwarded to the next working stage.

We hold DIN ISO 9001:2015 certification.

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isel Germany AG was founded in 1972 and is

the core company of the global isel Group.

The company develops, manufactures, markets,

sells and services systems and components

used for automation, automation control

systems, robots and related handling systems.

The company supports the global market needs

of the Semiconductor Equipment and related

industries, its activities are centered on the

company‘s expertise in automation and inter-

related technologies and include a broad array

of customer applications using the isel product

line as the foundation to address those needs.

isel Germany AG is located in Eichenzell (hesse)

and Dermbach (Thuringia), Germany.

Plant Dermbach

Plant Eichenzell

Plant Eiterfeld

Plant berlin

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ELECTRONICS

SOFTWARE

SYSTEMS

MECHANICS

WWW.iselrobotiK.com

Technical specifications subjects to change.

91021008_TK_Robotik

As at: october 2019

robotic department

bürgermeister-ebert-straße 40
36124 eichenzell / germany
phone: +49 (0) 66 59 / 981-0
e-mail: robotik@isel.com

development, production and sales of components
and systems in the sectors
mechanics, electronics, software and systems

program of tHe

-group